Snap, Print & Flip: Paste Printing for QFN Rework
SMT Magazine
Conventional solder paste methods are not viable for rework of QFN's. This article examines how paste printing can be used in the rework process. 
(added on 24-Jul-2006)   

A Proposed Remedy for Ball-in-Socket Defects
SMT Magazine
This article covers several commonly proposed root causes of ball-in-socket defects, and the use of an experimental reflow profile to solve these defects. 
(added on 24-Jul-2006)   

01005s and Lead-Free Solder
Assembly Magazine
Tiny 01005s are challenging for any electronics assembly process, but they’re even more so if that process is lead-free. 
(added on 14-May-2006)   

Evaluation of Conformal Coatings as a Tin Whisker Mitigation Strategy
The objective of this ongoing study is to evaluate the ability of conformal coatings to mitigate the formation and growth of tin whiskers. 
(added on 17-Mar-2006)   

Solutions for Advanced Rework Challenges
SMT Magazine (October 2005) cover story. Discusses solutions for today's latest rework challenges, including: small passives, single-ball reballing, stacked die, using integrated dispense, terhmal management, accuracy issues and lead-free. 
(added on 22-Jan-2006)