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0201 Sized Components
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White Papers and Technical Reports
Universal Instruments A collection of technical papers to help you keep up with this ever-evolving industry. They cover the following topics: Flip Chip and Die Placement Chip Scale Package (CSP) Circuit Board Technology Optoelectronics Pin-in-Paste 0201 Electrostatic Discharge (ESD) Adhesives and Dispensing Business and Operations 
Investigating 0201 Printing Issues and Stencil Design Circuits Assembly Experimental results on printer settings, stencil design and stencil technology for 0201s. (added on 10-May-2003)
Tombstoning of 0402 and 0201 components Plexus A description of this link is not yet available.
Manufacturing with 0201s: The Latest Developments Circuits Assembly This article discusses assembly of 0201 component, with a focus on placement and inline-inspection requirements. (added on 10-May-2003)
Impact of 0201 Components on Current Manufacturing Systems Circuits Assembly Paper originally presented at SMTA International 2002, Chicago, IL. (added on 27-May-2003)
PCB Design Optimization of 0201 Packages Technical note about the pad design for 0201 devices, and how it affects the assembly process.
0201 Processing and Materials Considerations Circuits Assembly Article that discusses how assembly problems with 0201s can be minimized. (added on 12-Jul-2003)
0201 Components Challenge Design and Assembly Very small passives, such as 0201 (0.02 in. × 0.01 in.) components, are finding their way into designs that were previously primarily dominated by 0603 and 0402 packages. This article describes the design and assembly process for such devices.
Process Parameters Optimization for Mass Reflow of 0201 Components Universal Instruments Article about tweaking of process parameters to get good yield and quality with 0201 assembly. (added on 16-Aug-2003)
Getting Started in Reworking 0201 Components Metcal Technical note by Metcal about the difficulties one may expect when starting to rework 0201 components
Automating 0201 Rework Circuits Assembly Next-generation ceramic capacitors including 0201s and 01005s pose new rework challenges due to their small size, tight adjacent spacing and thermal requirements. This articles provides some insights in how to deal with them (added on 13-Apr-2003)
manufacturing with Increasingly Smaller Components SMT Magazine Despite the benefits inherent in 0201 components, their use can complicate the assembly process. Understanding smaller component spacing requirements can create flexible, cost-effective products.
Volume Assembly Qualification for 0201 Packages SMT Magazine A qualification vehicle is designed that includes studies of such process parameters as solder-paste printing, component pick-and-place, and solder reflow. (added on 24-Apr-2003)
Placing Tiny Parts Precisely Assembly Magazine Design and Production considerations for using 0201 (or even smaller) components (added on 29-Dec-2002)
Reliable Solder Joints for 0201s Circuits Assembly A summary of the eutectic and lead-free solder reliability testing that has been performed while developing the 0201 process. (added on 25-Jan-2004)
0201 placement – Only with the Right Team and Tools SMTnet Library Excellent white paper explaining everything you need to know about placement of 0201 chips. (added on 14-Feb-2004)
Optimizing Reflow of 0201s Assembly Magazine When assembling boards with 0201s, the right process parameters can make a big difference in yield. (added on 07-Aug-2004)
Solutions for Advanced Rework Challenges SMT Magazine (October 2005) cover story. Discusses solutions for today's latest rework challenges, including: small passives, single-ball reballing, stacked die, using integrated dispense, terhmal management, accuracy issues and lead-free. (added on 22-Jan-2006)
01005s and Lead-Free Solder Assembly Magazine Tiny 01005s are challenging for any electronics assembly process, but they’re even more so if that process is lead-free. (added on 14-May-2006)
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© 2004 Daan Terstegge - All rights reserved. |