0201 Sized Components
White Papers and Technical Reports
A collection of technical papers to help you keep up with this ever-evolving industry. They cover the following topics:
Flip Chip and Die Placement
Chip Scale Package (CSP)
Circuit Board Technology
Electrostatic Discharge (ESD)
Adhesives and Dispensing
Business and Operations
Investigating 0201 Printing Issues and Stencil Design
Experimental results on printer settings, stencil design and stencil technology for 0201s.
(added on 10-May-2003)
Tombstoning of 0402 and 0201 components
A description of this link is not yet available.
Manufacturing with 0201s: The Latest Developments
This article discusses assembly of 0201 component, with a focus on placement and inline-inspection requirements.
(added on 10-May-2003)
Impact of 0201 Components on Current Manufacturing Systems
Paper originally presented at SMTA International 2002, Chicago, IL.
(added on 27-May-2003)
PCB Design Optimization of 0201 Packages
Technical note about the pad design for 0201 devices, and how it affects the assembly process.
0201 Processing and Materials Considerations
Article that discusses how assembly problems with 0201s can be minimized.
(added on 12-Jul-2003)
0201 Components Challenge Design and Assembly
Very small passives, such as 0201 (0.02 in. × 0.01 in.) components, are finding their way into designs that were previously primarily dominated by 0603 and 0402 packages. This article describes the design and assembly process for such devices.
Process Parameters Optimization for Mass Reflow of 0201 Components
Article about tweaking of process parameters to get good yield and quality with 0201 assembly.
(added on 16-Aug-2003)
Getting Started in Reworking 0201 Components
Technical note by Metcal about the difficulties one may expect when starting to rework 0201 components
Automating 0201 Rework
Next-generation ceramic capacitors including 0201s and 01005s pose new rework challenges due to their small size, tight adjacent spacing and thermal requirements. This articles provides some insights in how to deal with them
(added on 13-Apr-2003)
manufacturing with Increasingly Smaller Components
Despite the benefits inherent in 0201 components, their use can complicate the assembly process. Understanding smaller component spacing requirements can create flexible, cost-effective products.
Volume Assembly Qualification for 0201 Packages
A qualification vehicle is designed that includes studies of such process parameters as solder-paste printing, component pick-and-place, and solder reflow.
(added on 24-Apr-2003)
Placing Tiny Parts Precisely
Design and Production considerations for using 0201 (or even smaller) components
(added on 29-Dec-2002)
Reliable Solder Joints for 0201s
A summary of the eutectic and lead-free solder reliability testing that has been performed while developing the 0201 process.
(added on 25-Jan-2004)
0201 placement – Only with the Right Team and Tools
Excellent white paper explaining everything you need to know about placement of 0201 chips.
(added on 14-Feb-2004)
Optimizing Reflow of 0201s
When assembling boards with 0201s, the right process parameters can make a big difference in yield.
(added on 07-Aug-2004)
Solutions for Advanced Rework Challenges
SMT Magazine (October 2005) cover story. Discusses solutions for today's latest rework challenges, including: small passives, single-ball reballing, stacked die, using integrated dispense, terhmal management, accuracy issues and lead-free.
(added on 22-Jan-2006)
01005s and Lead-Free Solder
Tiny 01005s are challenging for any electronics assembly process, but they’re even more so if that process is lead-free.
(added on 14-May-2006)
© 2004 Daan Terstegge - All rights reserved.