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Adhesives
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Printing of SMT Adhesives
Technical paper about Printing of SMT Adhesives The major driving force is the higher throughput of this application method. More over, a new printing technique with thick stencils allows depositing of glue dots with different diameters and different heights. 
Step 5: Adhesives, Epoxies and Dispensing SMT Magazine Article about dispensing and stencilling surface mount adhesives. (added on 17-May-2003)
Intertronics Technical Bulletins & Articles INTERTRONICS Several Articles about subjects like ESD floors, wire tacking, Light Curing of Adhesives and Bonding of Optical Components
Upgrading to Micro-Volume Dispensing Electronic Packaging & Production The trend toward micro-assembly continues. This often calls for glue dot sizes approaching 10 mils in diameter. For the precise volumes required for micro-dispensing (0201 devices, BGAs, CSPs and flip chips) conventional pumps are often unsuitable. This article describes the use of a micro-volume pump. (added on 02-Mar-2003)
Encapsulants Electronic Production Electronics Production Magazine does not exist anymore, but their extremely usefull online-encyclopedia is still available from SMTinfo.net. This part gives an introduction to encapsulation, or potting, of electrical components.
Conductive Adhesives Electronic Production Electronics Production Magazine does not exist anymore, but their extremely usefull online-encyclopedia is still available from SMTinfo.net. This part gives an introduction to conductive adhesives.
Adhesives/Epoxies & Dispensing SMT Magazine This article highlights various material, dispensing and automation considerations before choosing the best solution for the application. (added on 23-May-2004)
Adhesives and Its Adhesives and Its Application Good series of slides with detailed information about adhesives, application methods, curing and DSC (differential scanning calorimetry) (added on 18-Jul-2004)
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© 2004 Daan Terstegge - All rights reserved. |