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Bare Boards
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PCB Design and Fabrication Website
PCB Design and Fab Guideline Rules to keep in mind when designing PCB's 
Baking PCBs: Why and How Circuits Assembly Today, due to the high quality of manufactured circuits, improved surface preparation and increased epoxy to laminate adhesion can often eliminate baking. Engineers should ask themselves: Why do we bake PCBs? What are the benefits? What temperature is required and for what time period? What are the disadvantages of baking? (added on 01-Jan-2003)
Printed Circuit Board Fabrication A graphical presentation of the major steps in PCB fabrication
Reducing Solder Voids with Copper-Filled Microvias Circuits Assembly A study was done to determine the effect of via filling on void formation in solder joints. The study compared conformal copper plating to partial and full via filling with copper. Different solder paste chemistries and reflow profiles were selected to provide a range of potential solder voids. Both cross section and x-ray analysis were performed to measure void size, occurrence and location. (added on 13-Apr-2003)
Pocket Guide to Excellent V-Scoring A detailed overview of the V-scoring process, with recommendations for specifying panels to be made with this technology.
Afraid of the Dark? Circuits Assembly Discussion about the condition known as ''black pad'' and it's effects on solder bonds on BGAs (added on 03-Jan-2003)
Making Printed Circuit Boards
Teledyne Halco Technical Library Tech papers about Hot Air Leveling, including a complete chapter of the Printed Circuit Board Materials Handbook. If you're looking for specifications of the HASL process or it's results, this is the page to visit.
Assessing The Reliability Of Plated Vias PCFAB When it comes to bare boards, are PTHs the weakest link? How fill material in buried core vias affects their reliability. (added on 22-May-2003)
The influence of PCB parameters on CSP assembly and reliability Advanced Packaging Extensive discussion about assembly and reliability of chip scale packages, and how these are affected by bare board parameters. (added on 17-May-2003)
Printed Circuit Board Defects Bob Willis Homepage Short Overview to Printed Circuit Board Defects
Printed Circuit Board Fabricators Homepage PCB fab This site offers advice and insights on the process for producing a Printed Circuit Board. The production process has been broken down into the different areas, to prevent confusion and allow easy access to the information within these areas. Unfortunately there are some 'under construction' areas, but still a very usefull website.
PCB substrates Think & Tinker, Ltd
Circuitree Magazine Circuitree Magazine This is the online version of CircuiTree Magazine, the resource for the printed circuit boards industry. Besides many technical notes in a seachable and browsable form there's also a message board where you can discuss with other experts.
Trends and Challenges of Environmentally Friendly Laminates PCFAB A study of electrical, heat, and moisture characteristics reveals halogen-free laminates display higher a Dk than brominated types, but those with a phosphorus base absorb high amounts of moisture. (added on 22-May-2003)
A Review of Epoxy Materials and Reinforcements, PART 1 PCFAB A study examines the properties of various epoxy materials and reinforcements as a guide to improve electrical and thermomechanical performance of PCBs. (added on 22-May-2003)
Multilayer fabrication Think & Tinker, Ltd
Manufacturing PCB's For the hobbyist: a guide to the manufacturing of doublesided printed circuit boards
A Review of Epoxy Materials and Reinforcements, PART 2 PCFAB Part 2 of a study that examines the properties of various epoxy materials and reinforcements as a guide to improve electrical and thermomechanical performance of PCBs. (added on 22-May-2003)
Matte-surface solder masks reduce solder ball defects TKB-4U This article provides a short description of the influence of surface liquid photoimageable solder masks on the number of solder balls remaining on printed circuit boards processed with no-clean flux. (added on 19-Sep-2003)
Microvia Formation: Technology and Cost Comparison Circuitree Magazine This article describes microvia formation with mechanical and UV and hybrid laser drilling. These methods are very different from technology perspective, but equally important are the costs associated with each technology. (added on 03-Jan-2003)
Pocket Guide to Perforated Breakaway Tabs TKB-4U Suggestions for layout of "rat-bite" breakaway tabs (added on 03-Apr-2003)
Improved organic solderability preservatives for mixed metal finishes Electrochemicals Inc. Article about the development and implementation of a new, improved OSP process
Avoiding the Voids Printed Circuit Design and Manufacture Technical article about the many possible causes of glass voiding (plating voids confined to the glass) (added on 30-Apr-2003)
Technical articles from Electrochemicals lnc Index page for several technical articles (HTML and PDF) focussed on the electrochemical materials used during PCB manufacturing.
Correlation of Assembly Data With Capability Studies for the HASL Process Circuitree Magazine The Correlation of Assembly Data With Capability Studies for the Hot Air Solder Level Process: Phase III Test Results Results of investagations by the 'Hot Air Leveling User Group' (HUG)
Electroplating Think & Tinker, Ltd
Drilling methods Think & Tinker, Ltd Article about Drilling Copperclad Substrates, focussed on making prototypes with a manual drilling method.
Etching techniques Think & Tinker, Ltd
Lamination: A Neglected Process Circuitree Magazine A good explanation about bare board lamination procedures. (added on 11-Oct-2003)
An Overview of the Advantages of Low CTE Materials Circuitree Magazine
Printed Circuit Prototyping Think & Tinker, Ltd Website of Think & Tinker, Ltd. about making PCB prototypes in a semi-professional way in an environmentally friendly way. The site has descriptions of each of the process steps.
PCB shop setup Think & Tinker, Ltd
Dry-film lamination Think & Tinker, Ltd
Design Information Table Morris Circuit Design Bare Board Design information Table of Morris Circuit Design. Can be used as a starting point for making your own checklist. (added on 25-Sep-2003)
Holewall activation Think & Tinker, Ltd Think & Tinker, Ltd: Holewall Activation Subjects of this page is holewall activation, based on a three step process of ink application, ink extraction and oven curing. Like the other pages on this website the section about holewall activation is dedicated to the needs of a PCB Prototyper.
Printed Circuit Imaging Think & Tinker, Ltd
Chemical analysis Think & Tinker, Ltd Think & Tinker, Ltd: Chemical Analysis Subjects of this page are Acid Copper Plating Bath Analysis and Maintenance, Tin/Lead (Solder) Plating Bath Analysis and Maintenance, Acid Tin Plating Bath Analysis and Maintenance and Etchant Analysis and Maintenance.
Testing Fine Pitch Surface Mount Designs Morris Circuit Design Brief explanation of bare board testing for fine-pitch designs. (added on 28-Sep-2003)
Embedded Passive Technology from a PCB Maker's Perspective Circuitree Magazine This article focuses on reduced tolerances and improved long-term stability, related to embedded resistor technologies. In addition, approaches like laser trimming, modification of curing methods for PTF resistors, and new embedded passive materials are examined. (added on 11-Oct-2003)
Implementing a Simple Corrosion Test Method to Detect Black Pad Phenomenon in Electroless Nickel/Immersion Gold Plating Circuitree Magazine This article describes a new testmethod for PCB Manufacturers for timely detection of black pad problems. (added on 02-Nov-2003)
Drill Smear in High Aspect Ratio, High Reliability Backpanels: Chemical and Plasma Processing Circuitree Magazine This article compares the wet chemical process with gas plasma treatment. (added on 16-Sep-2003)
Developing photopolymers Think & Tinker, Ltd Unlike copper etching, developing properly laminated and imaged dry-film photopolymers is easily accomplished by swishing your board about in a conventional photographic processing tray. This derives from the fact that the organic and radiation chemists who developed (and continue to develop) these films have done an excellent job of creating an entire class of easy-to-use and environmentally safe materials that are almost as tough as nails if processed according to published guidelines. The benefit of this will become apparent in this article.
Integrated Passives. Technology and Economics Circuits Assembly The latest from the recent NEMI roadmap. (added on 13-Sep-2003)
Blind and Buried Via PCBs - A Preview Morris Productions Page describing two manufacturing methods for buried and blind via's.
Soldermask Registration Considerations for Fine-Pitch Area Array Package Assembly SMT Magazine This articles explains how solder mask registration can cause shorts when soldering fine-pitch BGA's or CSP's, and it provides some tips on how to avoid such problems. I believe it's just about a week ago that I experienced exactly this same problem, so you'd better read this article before it happens to you ! (added on 31-Mar-2004)
Microvias Electronics Production Magazine does not exist anymore, but their extremely usefull online-encyclopedia is still available from SMTinfo.net. This part gives an introduction to microvia technology.
Rigid-Flex Circuits Electronic Production Electronics Production Magazine does not exist anymore, but their extremely usefull online-encyclopedia is still available from SMTinfo.net. This part gives an introduction to flex-rigid boards.
PCB Substrates Electronic Production Electronics Production Magazine does not exist anymore, but their extremely usefull online-encyclopedia is still available from SMTinfo.net. This part gives an introduction to pcb substrates.
The Search for the Universal SURFACE FINISH PCD&M Magazine An evaluation of the advantages – and limitations – of common surface finishes. (added on 07-Feb-2004)
Flexible PCBs and Plating Through Holes: Challenges and Solutions Circuitree Magazine In order to meet today’s demands for lower cost, mass-produced flex and flex-rigid panels, standard PTH must be modified. The desire to remove the plasma process requires some innovative ideas for new permanganate desmear or alternative pre-treatment for multilayer panels. (added on 18-Dec-2005)
Keeping Solder Joints Whole CircuiTree Magazine Effects of bulk phosphorous content of electroless nickel layers to solder joint integrity and their use for gold and aluminum wire bonding (added on 11-Sep-2004)
Bare Board Quality and Acceptance Take a Major Step Forward CircuiTree Magazine Explanation about the new revisions of IPC's bare board standards IPC-6012 and IPC-A-600. (added on 03-Oct-2004)
Recognizing Intelligent Design CircuiTree Magazine Some backgrounds to Design For Manufacturing of bare boards. (added on 22-Jan-2005)
Via Life vs. Temperature Stress Analysis of Interconnect Stress Test Circuitree A new data analysis methodology provides significant insight into plated through via reliability versus thermal stress temperature. (added on 29-Mar-2005)
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© 2004 Daan Terstegge - All rights reserved. |