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Component Manufacturers
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Motorola's Application Note 1231
Motorola Probably the best on-line document about BGA assembly and design 
Intel® Packaging Databook The Intel® Packaging Databook is intended to serve only as a data reference guide to Intel package selection and availability. As the packaging landscape changes very rapidly, information can become outdated very quickly. Please refer to the product specs on the Intel Developer Web Site for the most current detailed package information Use this page as an entry point to some good BGA Assembly and design information.
AMD Packaging Design AMD's Technical Library, with PDF documents about Surface-Mount Array Packages, Surface-Mount Leaded Packages, Thru-Hole Leaded Packages, Board Assembly, Package Materials-Controlled & Restricted Materials, Package Materials-Material Declaration Data Sheets and Package Characterization
Texas Instruments Lead-Free Solutions Texas Instruments Lots of information about leadfree soldering, with a special focus on TI's Nickel/Palladium finishes. (added on 03-Jul-2003)
National Semiconductor Packaging Design and Assembly
Amkor TechnologyProducts: Application Notes, Technical Articles and White Papers Amkor PDF documents on several subjects, i.e. lead-free, CSP's and BGA's. (added on 15-Aug-2003)
Altera Components Design and Assembly
Kemet Cracking of capacitors, explanation of several chipcapacitor numbering systems, and many other articles.
3D VLSI Packaging Technology About MCM's and CSP's
Alumina & Leaded Molded Technology Intel The packaging technologies used to manufacture or assemble three basic types of component packages are summarized in this chapter of Intel's Packaging Technology Databook (added on 28-Sep-2003)
Physical Constants of IC Package Materials Intel Some tables with material properties.
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© 2004 Daan Terstegge - All rights reserved. |