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Conductor Finishing
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Electroless Ni/Immersion Au Evaluation - Final Program Report
Northern UK Circuit Group HP-EADC has investigated the solder joint interfacial weakness associated with electroless nickel (Ni)/immersion gold (Au) printed circuit board (PCB) plating. In addition to investigating the potential root causes of this weakness, HP-EADC has developed a test that can be used to differentiate between acceptable and unacceptable solder joint strength. This report represents the HP-EADC E-Ni/I-Au program final report. (added on 27-Apr-2003) 
Afraid of the Dark? Circuits Assembly Discussion about the condition known as ''black pad'' and it's effects on solder bonds on BGAs (added on 03-Jan-2003)
Teledyne Halco Technical Library Tech papers about Hot Air Leveling, including a complete chapter of the Printed Circuit Board Materials Handbook. If you're looking for specifications of the HASL process or it's results, this is the page to visit.
Electroless Nickel Immersion Gold and Black Pad OMG Galvanotechnik GmbH Paper discussing investigations on Black Pad and other plagues on ENIG conductor finishing, which seem to be traceable to the nickel bath. (added on 29-Jul-2003)
SELECTION OF PWB FINISH
Soldering to Gold- A Practical Guide Alpha Metals Interesting article discussing important factors to consider and always keep in mind when making solder connections to Au plated surfaces. (added on 26-Jul-2003)
Tin Whisker Homepage NASA Electronic Parts and Packaging Program Tin Whisker Homepage of NASA Goddard Space Flight Center, with lots of information of tin whiskers and other metal whiskers, with a great selection of photographs illustrating this phenomenon. (added on 30-Apr-2003)
Effects of Conformal Coat on Tin Whisker Growth NASA Electronic Parts and Packaging Program This report provides status for an ongoing experiment to study the effects of Uralane conformal coating on tin whisker growth.
Going Beneath the Surface of Surface Finishes Circuitree Magazine In-depth discussion about the various surface finishes that are currenly available. (added on 24-Dec-2002)
Soldering to Gold over Nickel surfaces Articles
Basic Information Regarding Tin Whiskers NASA Electronic Parts and Packaging Program Answers to following questions: What are Tin Whiskers? What are the Mechanisms by which Tin Whiskers Form? What are the Risks/Failure Mechanisms Associated with Tin Whiskers? Why the Recent Attention to Tin Whiskers? What are the Commonly Reported Characteristics of Tin Whiskers? Suggestions for Reducing Risk of Tin Whisker Induced Failures
Soldering To Gold Over Nickel Surfaces Kester Short article about soldering to nickel/gold boardfinishes
Improved organic solderability preservatives for mixed metal finishes Electrochemicals Inc. Article about the development and implementation of a new, improved OSP process
Soldering SMD's Without Solder Paste
A Defense of Hot Air Solder Leveling: Three Perspectives on Why it is Still a Viable Solution Circuitree Magazine One of the conclusions of this article: In spite of all the hype about alternative finishes and the predicted demise of the Sn/Pb finish for PWBs, HAL remains the preferred method among contract manufacturers and OEMs. Seventy to eighty percent of all PWBs manufactured today are still specified with a Hot Air Solder Levelled Surface. Having said this, HAL is not for every application, but the capabilities and limitations are understood. Very fine tabs of less than 20-mil pitches, micro BGAs, wire bonding and heat sensitive materials are good candidates for alternate finishes. HAL, as a process, continues to be the most robust, cost-effective method of preserving solderability for assembly today. (added on 24-Dec-2002)
Hot Air Leveling Alternatives, How Much Do You Want to Spend? PCB fab
SIPAD FAQ's
SSD Revolution, Niche, or Revolutionary Niche
Managing the transition on a global scale
A Key Failure Mode Resulting in Interfacial Fracture of Soldered ENIG Surfaces
Implementing a Simple Corrosion Test Method to Detect Black Pad Phenomenon in Electroless Nickel/Immersion Gold Plating Circuitree Magazine This article describes a new testmethod for PCB Manufacturers for timely detection of black pad problems. (added on 02-Nov-2003)
NO HASL - WHAT'S THE HASSLE? SMTnet Article about the several alternatives to HASL conductor finishing, and how they affect In-Circuit Testability (added on 15-Nov-2003)
Corrosion Resistance of ENIG: An Improved Immersion Gold Process Circuitree Magazine Investigations on how plating bath chemistry influences corrosion resistance of ENIG. (added on 21-Dec-2003)
PCB Finishes Electronic Production Electronics Production Magazine does not exist anymore, but their extremely usefull online-encyclopedia is still available from SMTinfo.net. This part gives an introduction to bare board conductor finishing.
Surface Finishes: an OEM Perspective Circuitree Magazine Discussion about surface finishes, including some pictures of "black pad". (added on 11-Jan-2004)
The Search for the Universal SURFACE FINISH PCD&M Magazine An evaluation of the advantages – and limitations – of common surface finishes. (added on 07-Feb-2004)
Getting the Lead Out of Hot Air Soldering CircuiTree Magazine Article about leadfree alloys for Hot Air Solder Leveling (added on 03-Oct-2004)
Investigating Voids Circuits Assembly Investigations in the amount of voiding for various conductor finishes.It is concluded that the void profile of tin, silver and HASL is much smaller than for ENIG, possibly making these pad finishes more suitable for lead-free assembly. (added on 27-Jun-2004)
Keeping Solder Joints Whole CircuiTree Magazine Effects of bulk phosphorous content of electroless nickel layers to solder joint integrity and their use for gold and aluminum wire bonding (added on 11-Sep-2004)
SSD: The Other Surface Finish Circuits Assembly With lead-free and via-in-pad designs, solid solder deposit may finally find its niche. (added on 18-Dec-2004)
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© 2004 Daan Terstegge - All rights reserved. |