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Dispensing
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Step 5: Adhesives, Epoxies and Dispensing
SMT Magazine Article about dispensing and stencilling surface mount adhesives. (added on 17-May-2003) 
Upgrading to Micro-Volume Dispensing Electronic Packaging & Production The trend toward micro-assembly continues. This often calls for glue dot sizes approaching 10 mils in diameter. For the precise volumes required for micro-dispensing (0201 devices, BGAs, CSPs and flip chips) conventional pumps are often unsuitable. This article describes the use of a micro-volume pump. (added on 02-Mar-2003)
Finding the right dispenser for the application Electronics Manufacture & Test A review of how to evaluate your requirements for a dispensing system and what to look for on the market. (added on 21-Mar-2004)
Adhesives/Epoxies & Dispensing SMT Magazine This article highlights various material, dispensing and automation considerations before choosing the best solution for the application. (added on 23-May-2004)
Best Practices in Surface Mount Adhesive Dispensing Asymtek Great introduction to adhesive dispensing. (added on 18-Jul-2004)
Adhesives and Its Adhesives and Its Application Good series of slides with detailed information about adhesives, application methods, curing and DSC (differential scanning calorimetry) (added on 18-Jul-2004)
A Brief Comparison of Dispensing Technologies Chipscale Review Magazine Time-pressure systems, piston pumps and jetting compared. (added on 22-Jan-2005)
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© 2004 Daan Terstegge - All rights reserved. |