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Tutorial: Soldering Flip Chip and BGA Packages
Chip Scale Review Magazine The selection of solder, always an important issue, is particularly critical with flip chip and other miniature leadless packages, where the solder plays an increased structural role. Article by Mike Fenner, Indium Corp. Europe, London 
Introduction to Flip-Chip techniques part#1 IVF (The Swedish Institute of Production Engineering Research) Extensive introduction to flip-chip technology, with focus on materials, bonding techniques, reliability and design This is a part of the Nordic Electronics Packaging Guideline by The Swedish Institute of Production Engineering Research (IVF).
White Papers and Technical Reports Universal Instruments A collection of technical papers to help you keep up with this ever-evolving industry. They cover the following topics: Flip Chip and Die Placement Chip Scale Package (CSP) Circuit Board Technology Optoelectronics Pin-in-Paste 0201 Electrostatic Discharge (ESD) Adhesives and Dispensing Business and Operations
Reliability of Fine Pitch Solder Bump Flip-Chip-on-Flex: Designs and Assembly Techniques, Part 1 Kulicke & Soffa The assembly of flip chip ICs onto flex substrates can result in low cost, high performance solutions for computer, telecommunications, automotive, and consumer applications. This paper reviews the results obtained from various combinations of device, flex, and assembly configurations and draws conclusions on subsequent design and assembly recommendations.
Introduction to Flip-Chip techniques part#2 IVF (The Swedish Institute of Production Engineering Research) Part#2 of IVF's Introduction to flip-chip techiques
Introduction to Flip Chip FlipChips dot com This is the first in a series of flip chip tutorials intended for new flip chip users and potential users. Tutorial #1 presents the basics: an overview of what flip chip is and does, and how it is made.
Anisotropic Conductive Film (ACF)Flip Chip FlipChips dot com This is the fifth in a series of flip chip tutorials intended for new flip chip users and potential users. This part is an introduction to the use of anisotropic conductive films for flipchip applications
The influence of PCB parameters on CSP assembly and reliability Advanced Packaging Extensive discussion about assembly and reliability of chip scale packages, and how these are affected by bare board parameters. (added on 17-May-2003)
A New Process for Cleaning Flip Chip Devices:Reliability and Process Control Austin American Technology Description of a cleaning process that can be incorporated for Flip Chip cleaning applications with a high degree of reliability and safety. The process control capabilities and the closed-loop nature of the process provide clear advantages over other alternative methods
Solder Bump Flip Chip FlipChips dot com This is the second in a series of flip chip tutorials intended for flip chip users and potential users. Tutorial #2 presents an overview of solder bump flip chip bumping and assembly processes.
Flip chip soldering flux: Clean or no-clean processing? Advanced Packaging Small article about the use of flux for assembly of flip chips, and the need to clean after soldering. (added on 16-May-2003)
Flip Chip interconnect (C4 makes way for electroplated bumps) Motorola Semiconductor Products Sector
The Latest in Underfill for Advanced Chip Assembly Circuits Assembly This file described investigations on a new dispenseless underfill process for CSP's, compatible with standard SMT-processing (added on 20-Sep-2003)
Equipment Considerations for Flip-Chip Packaging Chip Scale Review Magazine As flip-chip-in-package (FCIP) continues to grow in popularity, the semiconductor packaging industry is acquiring a body of practical knowledge about factors related to cost, productivity and reliability. This summary covers some of the experience that Amkor has accumulated
Stud Bump Flip Chip FlipChips dot com This is the third in a series of flip chip tutorials intended for new flip chip users and potential users.
A Brief History of Flipped Chips FlipChips dot com The history of flip chips may be dated from the invention of IBM's SLT in 1961. The technology has evolved on many fronts, especially bumping and underfill. This article, the sixth in a series of flip chip tutorials intended for new flip chip users and potential users, gives an overview of the history of flipped chips.
Chip Scale Review Magazine Chip Scale Review Magazine
Electroless Nickel-Gold Flip Chip FlipChips dot com Electroless Nickel-Gold plating may be the lowest cost approach to bumping of flip chips, because it eliminates thin film and masking steps and permits batch processing. It has some limitations in height versus pitch and in assembly methods, but is widely available. This page, the latest in a series of flip chip tutorials, describes the bumping process and assembly of Ni-Au bumped flipchips.
Flipchips Dot Com FlipChips Dot Com is one of the best sources for free flip chip information. An independent, dedicated flip chip site to help users choose the right assembly process, find the right suppliers, and keep up with this rapidly changing microelectronics packaging field. On offer are tutorials, literature, photos, technology news, and a directory of qualified suppliers of flip chip services, equipment, and materials.
Kulicke & Soffa's Library Kulicke & Soffa Library with several PDF-documents about flipchip technology
Polymer Bump Flip Chip FlipChips dot com This is the fourth in a series of flip chip tutorials intended for new flip chip users and potential users. Tutorial #1 presented the basics: an overview of what flip chip is and does, and how it is made. This part covers solderless Flip Chip using polymer Flip Chip processes.
Underfill Update: NUF, MUF, WUF, and Other Stuff FlipChips dot com
Critical Issues of Wafer Level Chip Scale Package (WLCSP with Emphasis on Cost Analysis FlipChips dot com
Assembly Processes for Flip Chips on Substrates Advanced Packaging Study demonstrating the feasability of flip chip assembly on FR4 with and without nitrogen reflow. (added on 15-Nov-2003)
Exploring the Flip Chip to Achieve High Reliability
A Review and Trends in Flip-Chip Technology Chip Scale Review Although decades-old, flip-chip technology has only recently entered the packaging mainstream. This article presents an overview of different bumping technologies and reviews recent technology advances. (added on 11-Apr-2004)
Improving the Acceptance of Flip Chip Circuits Assembly Integrating flip chip attach (FCA) technology into surfacemount assembly lines has not been easy. Changes have to be made to the existing process, and new equipment has to be added. And not all FCA processes lend themselves to automated, in-line processing. (added on 11-Apr-2004)
Flipchips Electronic Production Electronics Production Magazine does not exist anymore, but their extremely usefull online-encyclopedia is still available from SMTinfo.net. This part gives an introduction to flip chips.
Selecting an underfill for flip chip packaging ADVANCED PACKAGING A description of this link is not yet available.
Flip Chip Processing for SIP Applications Assembly Magazine When designing flip chips for SIP modules, engineers must consider I/O layout, solder mask design, pad shape and bond pad metallization. (added on 29-Feb-2004)
Process Parameters for No-flow Underfills in Flip Chip Construction SMT Magazine Reflow encapsulants can replace traditional capillary flow underfills in many cases, simplifying the assembly process and reducing costs. (added on 25-Apr-2004)
Assembly and Reliability of a Wafer-Level CSP Circuits Assembly An experiment reveals that wafer-level devices can be assembled in high yield using standard surface-mount practices. (added on 23-May-2004)
Flip Chip Bonding: Flexible Circuit Devices Advanced Packaging Two interconnection methods were developed and evaluated for flip chip attachment of neural amplifier ASICS to flexible substrates. (added on 24-Oct-2004)
Impact of Flip Chip on Flex Processes Advanced Packaging This artile describes the mounting of flip chip components directly to flexible circuits. (added on 11-Dec-2004)
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© 2004 Daan Terstegge - All rights reserved. |