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HASL
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Teledyne Halco Technical Library
Tech papers about Hot Air Leveling, including a complete chapter of the Printed Circuit Board Materials Handbook. If you're looking for specifications of the HASL process or it's results, this is the page to visit. 
No-Lead and Horizontal Hot Air Leveling AIM Abstract: A great deal of research has gone into the development of lead-free alloys for electronic soldering applications. However, less emphasis has been placed on finding viable lead-free alternatives for the hot air leveling (HAL) operation used during the fabrication of printed circuit boards. In order to investigate this and determine a possible alternative to tin-lead for the PC Fab operation, Teledyne Electronic Technologies, Halco (TET Halco), and AIM have collaborated on a hot air leveling evaluation of CASTIN®. All testing to date has shown CASTIN® capable as an alternative to the tin-lead alloys presently used during HAL.
Overview Report on a Lead Free Electronics Industry Cemco Comprehensive report by Cemco providing backgrounds on the leadfree trend, with a focus on leadfree HASL. (added on 09-Nov-2003)
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© 2004 Daan Terstegge - All rights reserved. |