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Packaging
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Intel® Packaging Databook
The Intel® Packaging Databook is intended to serve only as a data reference guide to Intel package selection and availability. As the packaging landscape changes very rapidly, information can become outdated very quickly. Please refer to the product specs on the Intel Developer Web Site for the most current detailed package information Use this page as an entry point to some good BGA Assembly and design information. 
AMD Packaging Design AMD's Technical Library, with PDF documents about Surface-Mount Array Packages, Surface-Mount Leaded Packages, Thru-Hole Leaded Packages, Board Assembly, Package Materials-Controlled & Restricted Materials, Package Materials-Material Declaration Data Sheets and Package Characterization
Encapsulation Materials, Processes and Equipment Advanced Packaging The electronic package might appear to be just a tiny black container for holding the chip, but it really is a sophisticated system when we consider the tasks to be accomplished, and under extreme conditions. (added on 24-Oct-2004)
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© 2004 Daan Terstegge - All rights reserved. |