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Recent Additions
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Snap, Print & Flip: Paste Printing for QFN Rework
SMT Magazine Conventional solder paste methods are not viable for rework of QFN's. This article examines how paste printing can be used in the rework process. (added on 24-Jul-2006) 
A Proposed Remedy for Ball-in-Socket Defects SMT Magazine This article covers several commonly proposed root causes of ball-in-socket defects, and the use of an experimental reflow profile to solve these defects. (added on 24-Jul-2006)
01005s and Lead-Free Solder Assembly Magazine Tiny 01005s are challenging for any electronics assembly process, but they’re even more so if that process is lead-free. (added on 14-May-2006)
Evaluation of Conformal Coatings as a Tin Whisker Mitigation Strategy The objective of this ongoing study is to evaluate the ability of conformal coatings to mitigate the formation and growth of tin whiskers. (added on 17-Mar-2006)
Solutions for Advanced Rework Challenges SMT Magazine (October 2005) cover story. Discusses solutions for today's latest rework challenges, including: small passives, single-ball reballing, stacked die, using integrated dispense, terhmal management, accuracy issues and lead-free. (added on 22-Jan-2006)
Mean Green Corrosion Foresite Selective soldering on ImAg boards built with a no clean process can be a very touchy situation. (added on 22-Jan-2006)
Can you Clean a No Clean? Foresite This article looks at a specific case involving NTF returns with a customer using a no-clean process, and looks at developing a successful cleaning protocol for cleaning assemblies constructed with a no-clean process. (added on 22-Jan-2006)
Does Conformal Coating Stop Electrical Leakage Problems? Foresite This analysis shows that conformal coating is only effective if there are no ionic residues entrapped underneath - though conformal coating may slow the absorption of moisture, it does not over time prevent moisture absorption and reaction with ionic contamination. (added on 22-Jan-2006)
White Residue - Good or Bad - Part 1 Foresite This case looks at how different water qualities and cleaning chemistries affect the appearance of white residues and the cleaning effectiveness of BGAs. (added on 20-Dec-2005)
Flexible PCBs and Plating Through Holes: Challenges and Solutions Circuitree Magazine In order to meet today’s demands for lower cost, mass-produced flex and flex-rigid panels, standard PTH must be modified. The desire to remove the plasma process requires some innovative ideas for new permanganate desmear or alternative pre-treatment for multilayer panels. (added on 18-Dec-2005)
The Inspection Connection Advanced Packaging Magazine The Latest Technologies in Optical Inspection for PCB Assemblies (added on 18-Dec-2005)
Solder Vendors: Voiding Doesn't Affect Joint Reliability Circuits Assembly Thursday, 15 December 2005 : BANNOCKBURN, IL – A group of leading solder vendors today issued a statement asserting “no evidence” exists demonstrating voiding has “any significant impact” on solder joint reliability. (added on 18-Dec-2005)
Circuitry Parts Large (world largest, they say) online PCB schematic and footprint library with support for multiple EDA tools. (added on 18-Sep-2005)
pcb007.com Online magazine for the Printed Circuit Board (PCB), Electronics Manufacturing Services (EMS) and PCB Design Industries. (added on 18-Sep-2005)
Troubleshooting Underfill Void Elimination Advanced Packaging This article explores strategies for troubleshooting void problems in underfills. (added on 18-Sep-2005)
Building on a Basic X-ray Inspection Platform Advanced Packaging Configuring an X-ray Inspection System (added on 18-Sep-2005)
Board Level Assembly And Reliability Considerations Amkor How to achieve reliable results with Quad Flat No-Lead type Packages. (added on 05-Jul-2005)
Via Life vs. Temperature Stress Analysis of Interconnect Stress Test Circuitree A new data analysis methodology provides significant insight into plated through via reliability versus thermal stress temperature. (added on 29-Mar-2005)
Underfill Effects on BGA Drop, Bend, and Thermal Cycle Tests Advanced Packaging The use of a properly designed underfill can significantly improve drop and bend tests, and the thermal cycle performance of BGAs. (added on 06-Mar-2005)
The Future of CAD Libraries Printed Circuit Design and Manufacture Will IPC-7351 be adopted globally? Take a look into the creation of a land pattern standard. (added on 06-Mar-2005)
Transitioning to Lead-Free Assemblies Printed Circuit Design and Manufacture Convergence on a single lead-free alloy means studying compatibility (backward and forward), and materials and process development. (added on 06-Mar-2005)
10 Steps Toward RoHS Directive Compliance Printed Circuit Design and Manufacture Manufacturers will likely need documented, auditable systems to prevent non-compliant products from entering the EU. (added on 12-Feb-2005)
The Effects of Lead-Free on Board Shops Printed Circuit Design and Manufacture Assembly may bear the brunt of the lead-free movement, but fabrication won't be getting off unscathed. Materials, finishes and processes are likely to be affected, and the clock is ticking. (added on 12-Feb-2005)
Optimizing Pb-Free SMT Process Parameters Circuits Assembly A Taguchi approach reveals the most important process steps and best settings for screen-printing and reflow, as well as the best combination of paste and board finishes for lead-free soldering. (added on 06-Feb-2005)
Solder-Free Connections Assembly Magazine An introduction to press-fit technology (added on 22-Jan-2005)
Recognizing Intelligent Design CircuiTree Magazine Some backgrounds to Design For Manufacturing of bare boards. (added on 22-Jan-2005)
A Brief Comparison of Dispensing Technologies Chipscale Review Magazine Time-pressure systems, piston pumps and jetting compared. (added on 22-Jan-2005)
Assessing Solder Joint Reliability in Pb-Free Assemblies Circuits Assembly Research finds that bulk alloy properties are not a meaningful predictor of reliability. (added on 18-Dec-2004)
SSD: The Other Surface Finish Circuits Assembly With lead-free and via-in-pad designs, solid solder deposit may finally find its niche. (added on 18-Dec-2004)
Impact of Flip Chip on Flex Processes Advanced Packaging This artile describes the mounting of flip chip components directly to flexible circuits. (added on 11-Dec-2004)
Capillary Balls: Causes and Countermeasures Advanced Packaging How solder paste properties influence the amount of solder beading. (added on 11-Dec-2004)
Cause of Tin Whiskers Remains Elusive Advanced Packaging Although the rootcause of tin whiskers are still unknown, the knowledge about the phenomenon is growing. This article provides a short overview. (added on 11-Dec-2004)
Reliable Lead-free Wave and SMT Processes Advanced Packaging This article informs the reader about the many aspects to think of when implementing a lead-free wave soldering process. (added on 11-Dec-2004)
Lead-free and Lead Contamination SMT Magazine Short article about lead contamination of leadfree solder. (added on 07-Nov-2004)
The Relationship between Reflow Soldering Processes and Power Consumption SMT Magazine Report about a study that focused on optimization of the reflow process to meet material specifications and still produce a quality solder interconnect. The study also characterized the power required to achieve the optimized process. (added on 07-Nov-2004)
Flip Chip Bonding: Flexible Circuit Devices Advanced Packaging Two interconnection methods were developed and evaluated for flip chip attachment of neural amplifier ASICS to flexible substrates. (added on 24-Oct-2004)
Encapsulation Materials, Processes and Equipment Advanced Packaging The electronic package might appear to be just a tiny black container for holding the chip, but it really is a sophisticated system when we consider the tasks to be accomplished, and under extreme conditions. (added on 24-Oct-2004)
International Directory of X-Ray Inspection System Vendors ChipScale Review (added on 24-Oct-2004)
Profile Planner ECD Profile Planner is an Excel Workbook Application that allows you to match Solder Paste specifications and Oven specifications. (added on 24-Oct-2004)
Getting the Lead Out of Hot Air Soldering CircuiTree Magazine Article about leadfree alloys for Hot Air Solder Leveling (added on 03-Oct-2004)
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© 2004 Daan Terstegge - All rights reserved. |