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Reflow Soldering
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Wave & Reflow Soldering Troubleshooting Chart
SMTnet / Speedline Technologies Quickly find the most likely causes to soldering problems. (added on 27-Jul-2003) 
Thermal Profiling in Reflow Soldering Article about thermal profiling of reflow ovens.
STEP BY STEP SMT SOLDERING: Reducing Soldering Defects Loctite Article about reflow soldering and how it is influenced by the solder paste, including a description of Phased Reflow Alloys that may be used to prevent tombstoning. (added on 14-Aug-2003)
REFLOW SOLDER PROFILE DEVELOPMENT Guidelines for achieving the desired shape in each of the four zones of a solder profile
Bob Willis Guide to Solder Spots - A New Plague in Manufacture ? Bob Willis Homepage Introduction to solder spots, a problem in modern reflow assembly or in fact any process that involves solder paste.
Solder Balls Amtech Solder Products, Inc Discussion about the two types of solderballs, why they are formed and what can be done to prevent them.
ROBUST REFLOW PROFILE DESIGN
Reflow Soldering F.A.Q.'s Bob Willis Homepage Find the answers to some frequently asked questions about reflow soldering.
Reflow Profile Optimization SMT Magazine A generic profile is a solid place to start; however, it must be modified to achieve optimum solderability and the fewest defects for a given assembly. (added on 28-Sep-2003)
The Benefits of a Ramp-to-Spike Reflow Profile How a RTS profile can improve and simplify your reflow soldering process.
Troubleshooting Knotty PC Assembly Problems Amtech Solder Products, Inc Short discussion about troubleshooting the assembly process when soldering results get out of control.
Bringing, and keeping, machine soldering under control Article about thermal profiling of reflow ovens, focussing on ECD's equipment
Nitrogen in reflow
A Study on the Effect of Nitrogen Reflow Soldering in a Lead-free Process SMT in Focus How solder wetting is affected by changing reflow temperature profile parameters and atmosphere. (added on 04-Oct-2003)
Horizontal Convection 'across the board' SMT Magazine Explanation of 'Horizonal Convection' technology whereby in contrast to conventional ovens the air stream is directed parallel to the board's surface to promote uniformity of heating. (added on 09-Feb-2003)
N2 Inerting for Reflow of Lead-free Solders Advanced Packaging Article about the effects of nitrogen on reflow soldering results in lead-free assembly. (added on 15-Nov-2003)
REFLOW SOLDERING SMT in Focus Very good introduction to the reflow soldering process. (added on 31-Jan-2004)
Reflow soldering Electronic Production Electronics Production Magazine does not exist anymore, but their extremely usefull online-encyclopedia is still available from SMTinfo.net. This part gives an introduction to reflow soldering.
Reflow Profiling Electronic Production Electronics Production Magazine does not exist anymore, but their extremely usefull online-encyclopedia is still available from SMTinfo.net. This part gives an introduction to reflowsoldering.
Mounting of Surface Mount Components National Semiconductor General introduction to the SMT assembly process (added on 06-Mar-2004)
Solder Preforms in Circuits Assembly Circuits Assembly This articles gives some ideas on how machine placeable preforms can be used to locally increase solder fillets. (added on 11-Apr-2004)
A Code Of Practice for Thermal Profiling Electronic Assemblies Some recommendations about thermal profiling of soldering processes, generated by a joint industry-DTI funded research programme led by the National Physical Laboratory and several companies. (added on 04-May-2004)
Optimizing Reflow of 0201s Assembly Magazine When assembling boards with 0201s, the right process parameters can make a big difference in yield. (added on 07-Aug-2004)
THE QUICK POCKET REFERENCE FOR SOLDER ASSEMBLY AIM This is a condensed pocket reference designed to help the production line engineer assess his/her assembly problems. The content focuses on SMT, through-hole, hand soldering, and testing. (added on 15-Aug-2004)
Profile Planner ECD Profile Planner is an Excel Workbook Application that allows you to match Solder Paste specifications and Oven specifications. (added on 24-Oct-2004)
The Relationship between Reflow Soldering Processes and Power Consumption SMT Magazine Report about a study that focused on optimization of the reflow process to meet material specifications and still produce a quality solder interconnect. The study also characterized the power required to achieve the optimized process. (added on 07-Nov-2004)
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© 2004 Daan Terstegge - All rights reserved. |