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Repair and Rework
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Assembly with Intel Components: Rework Practices
The technology and process knowledge to effectively and efficiently repair BGAs already exists. An added attraction for BGA packages is that they are compatible with existing surface mount technology (SMT) assembly processes and equipment, so rework is fairly simple. To learn more about BGA rework practices, see: Preparing PCBs and Packages for Rework BGA Removal/Placement Cleaning Devices and Board After Removal BGA Re-balling Kits Solder Spheres µBGA On-Board BGA Test Sockets Socket Preparation Solder Paste Application Socket Placement Socket Reflow BGA Reflow Profiles 
Waste Not, Want Not Circuits Assembly Simplify BGA rework by reusing leftover solder. (added on 13-Apr-2003)
Circuit Technology Center Clear descriptions of many PCB repair procedures.
Reworking Lead-free Solder in PCB Assembly SMT Magazine While lead-free solder rework is more difficult because of the lack of wetting and wickability, successful rework and assembly methods have been developed with lead-free solders for all types of components. (added on 24-Jun-2003)
Getting Started in Reworking 0201 Components Metcal Technical note by Metcal about the difficulties one may expect when starting to rework 0201 components
Automating 0201 Rework Circuits Assembly Next-generation ceramic capacitors including 0201s and 01005s pose new rework challenges due to their small size, tight adjacent spacing and thermal requirements. This articles provides some insights in how to deal with them (added on 13-Apr-2003)
Component Rework: A Small World and Getting Smaller Circuits Assembly The difficulty faced when reworking very small parts can be overcome with new techniques and tools. (added on 03-Jan-2003)
Reworking Plastic and Other Heat-sensitive Components SMT Magazine Considerations for rework of heat-sensitive components. (added on 17-May-2003)
De-soldering plated through holes with lead-free solders. Circuits Assembly This process clinic explains how to select the proper tools and how to desolder and remove through-hole components. (added on 17-Sep-2003)
Updating MicroBlasting Technology For Electronics Manufacturing Electronic Packaging & Production Explanation of what modern MicroBlasting Technology offers and how it can best be used in electronic production. (added on 09-Feb-2003)
Bga Rework: A Comparitive Study Of Selective Solder Paste Deposition For Area Array Packages BEST Solder paste or flux paste, that's the question. This paper introduces a new method with a "remain in place" semi-permanent stencil. (added on 04-May-2004)
Lead-Free BGA Assembly Assembly Magazine Could a flip-chip ball-grid array (FCBGA) with 780 I/O be successfully assembled with lead-free solder at a peak reflow temperature below 260 C? How would lead-free solder affect joint reliability? How would it affect rework? A study was conducted to find out. (added on 07-Aug-2004)
Solutions for Advanced Rework Challenges SMT Magazine (October 2005) cover story. Discusses solutions for today's latest rework challenges, including: small passives, single-ball reballing, stacked die, using integrated dispense, terhmal management, accuracy issues and lead-free. (added on 22-Jan-2006)
Snap, Print & Flip: Paste Printing for QFN Rework SMT Magazine Conventional solder paste methods are not viable for rework of QFN's. This article examines how paste printing can be used in the rework process. (added on 24-Jul-2006)
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© 2004 Daan Terstegge - All rights reserved. |