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Solder Alloy
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Tutorial: Soldering Flip Chip and BGA Packages
Chip Scale Review Magazine The selection of solder, always an important issue, is particularly critical with flip chip and other miniature leadless packages, where the solder plays an increased structural role. Article by Mike Fenner, Indium Corp. Europe, London 
A Comparison of Lead-Free AIM Abstract: Based on recent market developments, it appears that the choice of suitable lead-free alloys to replace Tin-Lead for electronics assembly is narrowing. Three candidates have emerged as potential standards for the industry. They are the Tin-Copper eutectic (Sn99.3/Cu0.7), the Tin-Silver eutectic (Sn96.5/Ag3.5), and CASTIN® (Sn96.2/Ag2.5/Cu0.8/Sb0.5). This paper details extensive testing covering several variables that was conducted in order to make objective comparisons between the three alloys.
A Comparison of Lead-Free AIM Abstract: Based on recent market developments, it appears that the choice of suitable lead-free alloys to replace Tin-Lead for electronics assembly is narrowing. Three candidates have emerged as potential standards for the industry. They are the Tin-Copper eutectic (Sn99.3/Cu0.7), the Tin-Silver eutectic (Sn96.5/Ag3.5), and CASTIN® (Sn96.2/Ag2.5/Cu0.8/Sb0.5). This paper details extensive testing covering several variables that was conducted in order to make objective comparisons between the three alloys.
A Study of Lead-Free Alloys AIM Abstract: With the ongoing concerns regarding environmental pollutants, lead at one time was heavily targeted in the electronics assembly arena. AIM reacted to these concerns by developing its patented lead-free alloy CASTIN®. This paper highlights the development process and application information for CASTIN®.
Materials and Process Considerations for Lead-Free Electronics Assembly AIM Abstract: With the WEEE Directive in Europe potentially outlawing lead from some electronic devices produced and imported in the EU by 2006 and foreign competition driving the implementation of lead-free electronics assembly around the world, additional questions regarding the integrity and reliability of various alloy compositions continue to arise. In short, the issue of which alloy(s) to select continues to loom. This paper shall take an in-depth view of Sn/Ag, Sn/Ag/Cu and Sn/Cu alloys and compare the reliability testing results and process considerations for these.
Understanding Lead-Free Alloys AIM Abstract: One result of the push to find lead-free solder alternatives is that there are now many options available to the board assembler. Much development, patterning and research has gone into finding viable solutions for those who want to eliminate lead from their process. However, each of these alloys is different in significant ways and background information is necessary.
How Step Soldering Aids Intrusive Reflow AIM Abstract: To secure the benefits of reflow soldering for assemblies of mixed-technology components, a special solder paste alloy and procedure for low-temperature processing is suggested.
NEMI Report: A Single Lead-free Alloy Is Recommended SMT Magazine NEMI recommends a single lead-free alloy (Sn3.9/Ag0.6/Cu) to replace eutectic Sn/Pb solder for high-volume surface mount applications. This article explains why. (added on 26-Jan-2003)
Alloy Temperature Chart Kester Table with several types of alloys and their melting ranges
SOLDERING 101 Assembly Magazine Good introduction to soldering fluxes and alloys.
A Study of Antimony AIM Abstract: The issue of the toxicity of antimony has arisen as the search for viable lead-free alloys continues. Confusion regarding the toxicity of antimony has developed as a result of legislation concerning antimony trioxide, as well as unfounded speculation concerning the element in an alloyed form. This paper details third party and governmental studies and legislation concerning antimony and its ''toxicity''. This data then is compared to that of the ''safe'' elements that comprise the majority of lead-free solders, including silver, copper, zinc, compounds of tin, as well as lead. This data indicates that antimony is no more ''toxic'', often is far less-stringently regulated, and is classified as less of a health threat than many of the other aforementioned elements.
Integrity of Solder Joints from Lead-free Solder Paste Heraeus Circuit Materials Description of several lead-free alloys, and results of creep deformation testing for some of these materials. (added on 18-Oct-2003)
Solder Selection for Photonic Packaging AIM Abstract: As the worlds of electronics & photonics continue to merge, electronics manufacturers involved in traditional SMT assembly will be called upon to integrate optoelectronic component assembly into their SMT operations. While there are many challenges posed by the assembly of such complex hybrid packages, some of the most challenging revolve around how to assemble a diverse array of ceramic, glass and metal components within a package. Selecting the most appropriate solder for a particular application can help to manage some of these materials issues.
Eutectic Solder Electronic Production Electronics Production Magazine does not exist anymore, but their extremely usefull online-encyclopedia is still available from SMTinfo.net. This part explains what the often used term eutectic solder means.
Step 3: Solder Materials SMT Magazine This article by Jennie S. Hwang focuses on the critical aspects of lead-free solder joint material, as well as production processes. (added on 11-Jan-2004)
The Next Generation of Solders for Electronics Chip Scale Review Overview of Leadfree Solder Alloys (added on 11-Sep-2004)
Assessing Solder Joint Reliability in Pb-Free Assemblies Circuits Assembly Research finds that bulk alloy properties are not a meaningful predictor of reliability. (added on 18-Dec-2004)
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© 2004 Daan Terstegge - All rights reserved. |