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Solder Paste
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STEP BY STEP SMT SOLDERING: Reducing Soldering Defects
Loctite Article about reflow soldering and how it is influenced by the solder paste, including a description of Phased Reflow Alloys that may be used to prevent tombstoning. (added on 14-Aug-2003) 
Bob Willis Guide to Solder Spots - A New Plague in Manufacture ? Bob Willis Homepage Introduction to solder spots, a problem in modern reflow assembly or in fact any process that involves solder paste.
Ten Timely Tips: Solder Paste Handling Circuits Assembly Ten usefull tips about how to handle solder paste (added on 13-Apr-2003)
Assembling Chip-Scale Packages with High Yields Requires Care with Printing and Reflow Processes Chip Scale Review Magazine Indium Coropration's advices on assembly of Chip Scale Packages, with a focus on solder paste printing and reflow soldering (added on 29-Dec-2002)
Tombstoning Reduction Via Phased-reflow Soldering SMT Magazine Description of the mechanisms leading to tombstoning, and how the problem can be overcome by using special blend of alloys and particle sizes. (added on 24-Dec-2002)
Optimizing Solder Paste Rheology To Satisfy The Fast Print Process Loctite A description of this link is not yet available.
Using Phased Reflow Can ReduceTombstoning Defects Electronic Packaging & Production A drop-in solder paste replacement claims to decrease tombstones and reduce defect rates. (added on 09-Feb-2003)
Considerations for the Pin Probe Testing of No-Clean Paste Residues AIM Pin probe testing difficulties can directly affect products' cost, time to market, and performance. This paper shall address these concerns and discuss the means by which many of the difficulties currently associated with pin probe testing can be eliminated. The most important of these factors are paste chemistry, length of time between reflow and testing, and the type and number of reflow profiles to which the paste is exposed. In addition, testing process variables such as probe point style, probe tube and socket material, spring force, type of contact and material, and the test environment are addressed.
The Development of a Pin Probe Testable Solder Paste AIM Abstract: In theory, all solder pastes are pin probe testable. However, very few pastes possess the broad process window that allows them to perform successfully under a wide-variety of pin testing methods. Furthermore, many solder pastes marketed as ''pin probeable'' leave residues with marginal insulation characteristics that can result in poor long-term reliability. In addition to paste chemistry, the pin probe testability of a solder paste is directly dependent upon several process factors. The most important of these factors are length of time between reflow and testing and the type and number of reflow profiles to which the paste is exposed. Other factors include the type of probes utilized, the spring forces, and the type of parts being probed.
Alternatives to Solvent Cleanable Solderpaste Kester Rather old article of Litton Kester about the various solder paste types in relation to cleaning options after the elimination of CFC-113
Expanding the Electronics Assembly Process Window: the New Generation of Solder Pastes AIM Abstract: Many engineers are unaware that the process windows for solder pastes have been greatly expanded recently, and therefore continue to utilize products that do not provide optimal results. Comparisons of the previous generation and the newest generation of pastes are provided, as well as a discussion of how new chemistry technologies can improve throughput, reduce waste and costs, and eliminate many of the defects and headaches that are often thought to be unavoidable. The paper ends with a discussion of how to achieve the best throughput and reduce defects by instituting optimal handling and processing techniques.
The SMT Process Benchmarking Toolkit Heraeus Circuit Materials Description of benchmark tests and a dedicated testboard to examine stencil printing process parameters and solder pastes. (added on 18-Oct-2003)
An Introduction To Solder Materials Heraeus Circuit Materials This paper explores solder paste materials and evaluation methodology. (added on 18-Oct-2003)
A Novel Method For Determining The Pin Testability Of Solder Flux Residue Heraeus Circuit Materials Paper that describes how pin testability can be evaluated as a function of of flux residues and the type of testprobe. (added on 18-Oct-2003)
Solder Paste Electronic Production Electronics Production Magazine does not exist anymore, but their extremely usefull online-encyclopedia is still available from SMTinfo.net. This part gives an introduction to solder paste.
Mounting of Surface Mount Components National Semiconductor General introduction to the SMT assembly process (added on 06-Mar-2004)
THE QUICK POCKET REFERENCE FOR SOLDER ASSEMBLY AIM This is a condensed pocket reference designed to help the production line engineer assess his/her assembly problems. The content focuses on SMT, through-hole, hand soldering, and testing. (added on 15-Aug-2004)
Capillary Balls: Causes and Countermeasures Advanced Packaging How solder paste properties influence the amount of solder beading. (added on 11-Dec-2004)
Optimizing Pb-Free SMT Process Parameters Circuits Assembly A Taguchi approach reveals the most important process steps and best settings for screen-printing and reflow, as well as the best combination of paste and board finishes for lead-free soldering. (added on 06-Feb-2005)
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© 2004 Daan Terstegge - All rights reserved. |