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Solder Vendors: Voiding Doesn't Affect Joint Reliability
Circuits Assembly
Thursday, 15 December 2005 : BANNOCKBURN, IL – A group of leading solder vendors today issued a statement asserting “no evidence” exists demonstrating voiding has “any significant impact” on solder joint reliability. 
(added on 18-Dec-2005)   

Lead-Free Hand Soldering of PTH Parts
Circuits Assembly
Bob Willis explains how to solder PTH parts with leadfree solder. 
(added on 11-Sep-2004)   

THE QUICK POCKET REFERENCE FOR SOLDER ASSEMBLY
AIM
This is a condensed pocket reference designed to help the production line engineer assess his/her assembly problems. The content focuses on SMT, through-hole, hand soldering, and testing. 
(added on 15-Aug-2004)   

Solder Preforms in Circuits Assembly
Circuits Assembly
This articles gives some ideas on how machine placeable preforms can be used to locally increase solder fillets. 
(added on 11-Apr-2004)   

Hirsch Metals Corporation
Hirsch Metals Corporation
Introductory level articles about fluxes, solder and dross  
(added on 04-Oct-2003)   

 

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Wave & Reflow Soldering Troubleshooting Chart
SMTnet / Speedline Technologies
Quickly find the most likely causes to soldering problems. 
(added on 27-Jul-2003)   


Making Better Contacts, A Guide to Surface Mount Technology
Amtech Solder Products, Inc
AMTech's Guide to the SMT Assembly Proces, with emphasis on the materials to be used for soldering and cleaning of products. In spite of the commercial contents there's some good information, especially for newcomers to the Surface Mount Process. 


Are You Ready for Lead-Free Assembly?
KIC
 


Soldering Electronic Assemblies
Kester
Abstract The soldering process is a total system of interrelated factors involving solder, flux, solderability and heat. The reliability of an electronic assembly is directly related to the quality of the soldered connections. This paper discusses the basic principles of soldering and what controls are necessary to achieve high quality and productivity. 


The Science Behind Conveyor Oven Thermal Profiling
KIC
 


Articles on Electronics Assembly and SMT
ITM Consulting
From this page you can access articles written by or pertaining to ITM. You'll find information on SMT and through-hole technologies, soldering and solderability, component placement, BGAs, paste printing, emerging technologies and lead-free soldering among others.
In addition, you will be able to access the complete collection of Phi Zarrow's award winning column, published in Circuits Assembly magazine.
Registration is required. 


Manufacturing Considerations When Implementing Voc-Free Flux Technology
The successful implementation of VOC-free flux technology requires some process modification for most of the existing wave soldering equipment. An increased air flow across the circuit boards is needed to drive off most of the water present in VOC-free fluxes. The purpose of this paper is to present a modification that can be installed onto existing equipment to help drive off the excess water. The suggested network of tubing is easy to assemble and easy to retrofit onto existing equipment. 


New Heating Method Yields Better Solder Joints
AMP / Tyco Electronics
Constant temperature -- that's one secret to producing high-quality, reliable solder joints. A new soldering technology provides constant temperatures even when thermal loads and application time vary. This means that one variable of the process is brought under very tight control.
The technology provides a self-regulating temperature source (SRTS). Not only does the heater strip not overheat or underheat, it does not rely on feedback to adjust for fluctuating temperatures. Feedback, after all, responds to variations. With SRTS, temperature is held constant by the material, so there is no need for feedback.  


A Comparison of Methods for Attaching Thermocouples to Printed Circuit Boards for Thermal Profiling
KIC
 


Electroless Nickel/Immersion Gold, Solderability and Solder Joint Reliability as Functions of Process Control
Circuitree Magazine
 


Tutorial: How Reflow Oven Selection Impacts Manufacturing Efficiency
Chip Scale Review Magazine
 


Advances in Thermal Profiling for Reflow Process Control
KIC
 


ITRI/NPL DTI report on lead-free soldering
After filling in a form you can download the ITRI/NPL DTI report on the current status of Pb-Free soldering 


KIC's On-line library
KIC
From here you can acces KIC's Application Notes, Whitepapers, Magazine Articles and Conference Papers, all related to thermal profiling. 


Electroless Nickel Immersion Gold and Black Pad
Circuitree Magazine
One of the conclusions of this article:
In spite of all the hype about alternative finishes and the predicted demise of the Sn/Pb finish for PWBs, HAL remains the preferred method among contract manufacturers and OEMs. Seventy to eighty percent of all PWBs manufactured today are still specified with a Hot Air Solder Levelled Surface. Having said this, HAL is not for every application, but the capabilities and limitations are understood. Very fine tabs of less than 20-mil pitches, micro BGAs, wire bonding and heat sensitive materials are good candidates for alternate finishes. HAL, as a process, continues to be the most robust, cost-effective method of preserving solderability for assembly today. 


Correlation of Assembly Data With Capability Studies for the HASL Process
Circuitree Magazine
The Correlation of Assembly Data With Capability Studies for the Hot Air Solder Level Process: Phase III Test Results

Results of investagations by the 'Hot Air Leveling User Group' (HUG)  


Reducing Oven Changeover Time by Finding Common Recipes for Mixed Production Lines
KIC
 


Maximizing Reflow Yield with Advanced No-clean Ovens and Real-time Thermal Managers
KIC
 


An Overview of the Advantages of Low CTE Materials
Circuitree Magazine
 


The Effect of Lead-Free Electronic Assembly on the Semiconductor Industry
KIC
 


Hirsch Metals Corporation
Hirsch Metals Corporation
Introductory level articles about fluxes, solder and dross  
(added on 04-Oct-2003)   


Predicting Reliability of Printed Wiring Boardswith Variable Parameters Using Finite Element Modeling
Circuitree Magazine
 


Volatile organic compounds
Electronic Production
Electronics Production Magazine does not exist anymore, but their extremely usefull online-encyclopedia is still available from SMTinfo.net. This part explains what VOC's are. 


Solder Preforms in Circuits Assembly
Circuits Assembly
This articles gives some ideas on how machine placeable preforms can be used to locally increase solder fillets. 
(added on 11-Apr-2004)   


Solder Vendors: Voiding Doesn't Affect Joint Reliability
Circuits Assembly
Thursday, 15 December 2005 : BANNOCKBURN, IL – A group of leading solder vendors today issued a statement asserting “no evidence” exists demonstrating voiding has “any significant impact” on solder joint reliability. 
(added on 18-Dec-2005)   


THE QUICK POCKET REFERENCE FOR SOLDER ASSEMBLY
AIM
This is a condensed pocket reference designed to help the production line engineer assess his/her assembly problems. The content focuses on SMT, through-hole, hand soldering, and testing. 
(added on 15-Aug-2004)   


Lead-Free Hand Soldering of PTH Parts
Circuits Assembly
Bob Willis explains how to solder PTH parts with leadfree solder. 
(added on 11-Sep-2004)   


 


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