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Testing
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Electronics Testing into the 21st Century:Success in Test Is in Capabilities, Not Specifications
Article from Equipment Reliability Institute 
Considerations for the Pin Probe Testing of No-Clean Paste Residues AIM Pin probe testing difficulties can directly affect products' cost, time to market, and performance. This paper shall address these concerns and discuss the means by which many of the difficulties currently associated with pin probe testing can be eliminated. The most important of these factors are paste chemistry, length of time between reflow and testing, and the type and number of reflow profiles to which the paste is exposed. In addition, testing process variables such as probe point style, probe tube and socket material, spring force, type of contact and material, and the test environment are addressed.
The Development of a Pin Probe Testable Solder Paste AIM Abstract: In theory, all solder pastes are pin probe testable. However, very few pastes possess the broad process window that allows them to perform successfully under a wide-variety of pin testing methods. Furthermore, many solder pastes marketed as ''pin probeable'' leave residues with marginal insulation characteristics that can result in poor long-term reliability. In addition to paste chemistry, the pin probe testability of a solder paste is directly dependent upon several process factors. The most important of these factors are length of time between reflow and testing and the type and number of reflow profiles to which the paste is exposed. Other factors include the type of probes utilized, the spring forces, and the type of parts being probed.
A Novel Method For Determining The Pin Testability Of Solder Flux Residue Heraeus Circuit Materials Paper that describes how pin testability can be evaluated as a function of of flux residues and the type of testprobe. (added on 18-Oct-2003)
Testing Fine Pitch Surface Mount Designs Morris Circuit Design Brief explanation of bare board testing for fine-pitch designs. (added on 28-Sep-2003)
NO HASL - WHAT'S THE HASSLE? SMTnet Article about the several alternatives to HASL conductor finishing, and how they affect In-Circuit Testability (added on 15-Nov-2003)
Automated AMI Analysis of Components Prior to Board Assembly SMT Magazine In some production lines, automated acoustic micro imaging (AMI) is used to detect anomalies in packaged components before board assembly. (added on 27-Sep-2003)
Step 9: Test & Inspection SMT Magazine Discussion that offers guidelines and considerations to assist in selecting the optimal strategy for PCB test and inspection. (added on 09-Nov-2003)
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© 2004 Daan Terstegge - All rights reserved. |