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Tin
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The Tin Commandments
AMP / Tyco Electronics AMP's Guidelines for the Use of Tin Plate on Electrical Contacts 
NEMI Recommends Standard Test Methods to Assess Propensity for Tin Whisker Growth SMT Magazine Standard test methods for tin whiskers will help the industry move more quickly in evaluation and development of Sn-based Pb-free finishes. (added on 28-Nov-2003)
Evaluation of Conformal Coatings as a Tin Whisker Mitigation Strategy The objective of this ongoing study is to evaluate the ability of conformal coatings to mitigate the formation and growth of tin whiskers. (added on 17-Mar-2006)
Cause of Tin Whiskers Remains Elusive Advanced Packaging Although the rootcause of tin whiskers are still unknown, the knowledge about the phenomenon is growing. This article provides a short overview. (added on 11-Dec-2004)
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© 2004 Daan Terstegge - All rights reserved. |