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Tombstoning
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STEP BY STEP SMT SOLDERING: Reducing Soldering Defects
Loctite Article about reflow soldering and how it is influenced by the solder paste, including a description of Phased Reflow Alloys that may be used to prevent tombstoning. (added on 14-Aug-2003) 
Tombstoning of 0402 and 0201 components Plexus A description of this link is not yet available.
Reducing The Tombstoning of Small Discrete Components AIM Abstract: Continued product miniaturization has driven passive component sizes down from 0805 & 0603 to 0402 & 0201 dimensions. By saving precious PWB real estate, this trend usually results in higher performance through a lighter, smaller product however, it also can have the undesired effect of increased defects during the assembly process. The most prevalent defect when assembling devices with these small discrete components is tombstoning. This paper discusses the most common causes of this defect and provides a variety of practical cures.
The Persistent Problem of Tombstoning Circuits Assembly Understanding this phenomenon and how to prevent it. (added on 09-Jun-2003)
Tombstoning Reduction Via Phased-reflow Soldering SMT Magazine Description of the mechanisms leading to tombstoning, and how the problem can be overcome by using special blend of alloys and particle sizes. (added on 24-Dec-2002)
Reflow Profile Optimization SMT Magazine A generic profile is a solid place to start; however, it must be modified to achieve optimum solderability and the fewest defects for a given assembly. (added on 28-Sep-2003)
Using Phased Reflow Can ReduceTombstoning Defects Electronic Packaging & Production A drop-in solder paste replacement claims to decrease tombstones and reduce defect rates. (added on 09-Feb-2003)
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© 2004 Daan Terstegge - All rights reserved. |