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Underfilling
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Reliability of Fine Pitch Solder Bump Flip-Chip-on-Flex: Designs and Assembly Techniques, Part 1
Kulicke & Soffa The assembly of flip chip ICs onto flex substrates can result in low cost, high performance solutions for computer, telecommunications, automotive, and consumer applications. This paper reviews the results obtained from various combinations of device, flex, and assembly configurations and draws conclusions on subsequent design and assembly recommendations. 
Chip-Scale Package Assembly Reliability Chip Scale Review Magazine Although the weakest link of CSP assembly reliability is often internal package failure, solder-joint fatigue is still considered the key reliability factor.
The Latest in Underfill for Advanced Chip Assembly Circuits Assembly This file described investigations on a new dispenseless underfill process for CSP's, compatible with standard SMT-processing (added on 20-Sep-2003)
A Brief History of Flipped Chips FlipChips dot com The history of flip chips may be dated from the invention of IBM's SLT in 1961. The technology has evolved on many fronts, especially bumping and underfill. This article, the sixth in a series of flip chip tutorials intended for new flip chip users and potential users, gives an overview of the history of flipped chips.
Underfill Update: NUF, MUF, WUF, and Other Stuff FlipChips dot com
Exploring the Flip Chip to Achieve High Reliability
Selecting an underfill for flip chip packaging ADVANCED PACKAGING A description of this link is not yet available.
Processing and Reliability of Corner-bonded CSPs Advanced Packaging This article presents an alternative to fully underfilling components to protect them from vibration, shock and dropping trauma. (added on 21-Mar-2004)
Process Parameters for No-flow Underfills in Flip Chip Construction SMT Magazine Reflow encapsulants can replace traditional capillary flow underfills in many cases, simplifying the assembly process and reducing costs. (added on 25-Apr-2004)
Troubleshooting Underfill Void Elimination Advanced Packaging This article explores strategies for troubleshooting void problems in underfills. (added on 18-Sep-2005)
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© 2004 Daan Terstegge - All rights reserved. |