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Some tools for component failure analysis - Analytical techniques
This free sample chapter discusses analytical methods that can be used for failure analysis of
electronic components or printed circuit board assembles. Techniques include Auger
Microanalysis (SAM), Ultrasonic and Optical Imaging (C-SAM or AMI), Electron Beam Induced Current
(EBIC), Electron Microscopy (SEM), Dispersive X-Ray Spectroscopy (EDS or EDX), Force Microscopy and
Scanning Probe Microscopy (AFM/SPM), Dispersive X-Ray Spectrometry (WDS), ESCA (Electron
Spectroscopy for Chemical Analysis, Transform Infrared Spectroscopy (FTIR)
Panelization and de-panelizing
Designers, assemblers and boardshops should work concurrently on board-panelization. Read this free
sample chapter of the DFM/CE book and see how damage during depanelization can be
prevented.
POD PCB, PCBA, QUALITY CONFORMANCE, & TEST DFM/CE CHECK LISTS
The purpose of this document's check-lists is to provide
a systematic design audit/review tool and process to assess all design for manufacturing
requirements using concurrent engineering. This document's purpose is also to ensure all
DFM/CE team members, throughout the supply chain, provide vital input so processes can be
managed instead of results as defect.
The scope of this check-list extends to all personnel, phases and elements required to ensure PCB's
and PCBA's are manufacturable and capable of being processed in qualified supplier
capabilities.
Please note that this document is a sample fom the previous release
of the book.
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